Course structure: Class 1 DRAM/SRAM/FLASH/MRAM/Emerging memory/... Class 2 DRAM Design Device – 2hr Class 3 Front End process- Photo - 2hr Class 4 Front End process- Dry Etch Process - 2hr Class 5 Front End process- DIR/TF/CMP/WET/RAM Process –part 1- 2hr Class 6 Front End process- DIR/TF/CMP/WET/RAM Process –part 2- 2hr Class 7 Front End process- DIR/TF/CMP/WET/RAM Process –part 3- 2hr Class 8 SMAI(Smart Manufacturing & AI) (2hrs) Class 9 Data Science – 2hr Class 10 Mid-term exam – 2hr Class 11 Quality Engineering- 2hr Class 12 Yield rate Engineering - 2hr Class 13 Backend process- part 1- 2hr Class 14 Backend process- part 2- 2hr Class 15 Field Application Engineering -(2 hrs) Class 16 Final Exam The detail agendas of each function: - DRAM Design Device (DEG) - DRAM Design, Device (DEG) What's DRAM DRAM Application DRAM Architecture Product Testing - FE Process - Photo Process Dry Etch Process CMP Process Thin Film Process Diffusion Process WET Process - SMAI(Smart Manufacturing & AI - Data engineering challenges in semiconductor data Machine learning challenges in production Deep learning for memory array failure classification Data Science application in photolithography - YE - YE: DRAM probing and failure analysis - Quality – DRAM Advanced Defect detection and Methodology Application Machine Learning on Advanced Process Control - BE Package & Test – Advanced package introduction - now and future Memory Packaging Technology Roadmap - Field Application Engineering – Field Application Engineering DRAM Basic Operations and (System) Design Considerations Market requirements vs. different type of DRAM and trend Features of DDR4/DDR5/LPDDR4/LPDDR5/GDDR6x Near Memory, Main Memory and Far Memory High speed memory design guide and considerations

讓學生了解DRAM的製程與設計。 隨著5G運用、人工智慧、雲端運算、智慧醫療和數位轉型，相關終端應用包含高階伺服器、AI運算顯示卡、雲端電腦及5G通訊等，不僅僅只是需要配置記憶體，記憶 體速度與功率表現直接攸關開發產品競爭力，多樣化記憶體產品應用及重要性正逐年提升 。為讓學員對DRAM具備基本知識，本課程除DRAM結構原理，將從前段的研發 設計、晶圓的生產製造、測試、故障分析與品質管理，到後段封裝測試以及產品應用，提供一系列的介紹，引導學員了解DRAM與應用與趨勢、技術及挑戰，以及記憶 體在台研發製造的戰略價值。

基本元件及製程技術，如半導體工程。 成績評量：期中(50%)及期末討論工作坊(50%)。

《Dynamic RAM : technology advancements / Muzaffer A. Siddiqi.》 https://ntu.primo.exlibrisgroup.com/discovery/fulldisplay?docid=alma991038570789804786&context=L&vid=886NTU_INST:886NTU_INST&lang=zhtw&search_scope=MyInst_and_CI&adaptor=Local%20Search%20Engine&tab=Everything&query=any,contains,Dynamic%20Random%20Access%20Memory&offset=80 《Dram circuit design : fundamental and high-speed topics / Brent Keeth ... [et al.]》 https://ntu.primo.exlibrisgroup.com/discovery/fulldisplay?docid=alma991003751329704786&context=L&vid=886NTU_INST:886NTU_INST&lang=zhtw&search_scope=MyInst_and_CI&adaptor=Local%20Search%20Engine&tab=Everything&query=any,contains,Dynamic%20Random%20Access%20Memory&offset=10 以上書目均在台大圖書館。