由於本課程以半導體實作為主，因設備使用以及台積電參訪人數限制，不開放初選，請同學見諒，但請歡迎踴躍來信申請修課。 因課程無法補做實驗，為避免無法繳交報告影響修課成績，請欲修課之學生先確認上課時段皆能出席後，準備200字之自我介紹、修課動機、以及未來職涯發展規劃，信件標題請用"半導體製程與設備"，寄至授課老師信箱 (stevechen@ntu.edu.tw)，以回覆加選編號。 除校內課程，4/11以及4/25將至台積電新人訓練中心（NTC，New Trainer Center）由台積電業師進行移地授課。 本課程提供基礎的半導體電晶體元件製程技術概論，並結合電晶體元件實作訓練，學生將親手操作半導體製程核心設備，全面掌握元件製造的關鍵流程，課程核心內容包含： 1. 製程原理解說：深入探討半導體製程的物理與化學原理，亦透過實際操作設備，體驗從晶圓準備到最終元件形成的完整流程。 2. 關鍵製程技術與設備說明：課程涵蓋多項核心技術與所使用之設備，包括：微影、薄膜沉積、蝕刻等。 3. 半導體元件製作與量測：學生將親手製作半導體電晶體元件，製程完成後，透過形貌分析、薄膜厚度量測與電性特性量測等設備，觀察元件結構並驗證其性能表現。 This course provides a fundamental introduction to semiconductor field-effect transistor device fabrication technologies, combined with hands-on training in transistor device processing. Students will operate core semiconductor fabrication equipment and gain a comprehensive understanding of the key processes involved in device manufacturing. The main topics include: 1. Process Principles: In-depth exploration of the physical and chemical principles of semiconductor fabrication, accompanied by practical operation of equipment to experience the complete process—from wafer preparation to final device formation. 2. Key Fabrication Techniques and Equipment: Coverage of essential technologies and related equipment, including photolithography, thin-film deposition, and etching. 3. Device Fabrication and Characterization: Students will fabricate semiconductor transistor devices and, after completing the process, analyze their morphology, measure film thickness, and evaluate electrical performance using advanced characterization tools to verify device functionality.

本課程將培養學生兼具理論基礎與實務操作的能力，透過系統性教學讓學生深入理解半導體元件製作中各項關鍵製程科技以及所使用之設備。課程除介紹半導體製程的理論架構外，亦強調實作訓練，學生將親自操作關鍵半導體製程設備，完成半導體電晶體元件的實際製作與特性量測。藉由理論與實務的結合，培養學生對製程整合的整體概念、問題分析與解決能力。 This course aims to equip students with both theoretical foundations and practical skills in semiconductor fabrication. Through systematic instruction, students will gain a deep understanding of key semiconductor processing technologies and the equipment involved in device manufacturing. In addition to introducing the theoretical framework of semiconductor processes, the course emphasizes hands-on training. Students will personally operate essential fabrication tools to complete the actual fabrication and characterization of semiconductor transistor devices. By integrating theory with practice, the course cultivates students’ comprehensive understanding of process integration as well as their abilities in problem analysis and solution development.

1. 前四週及期中期末考試於一般教室上課，其餘週次於無塵室進行實作教學。 2. 參加無塵室實驗課程時，請務必穿著長褲等符合安全訓練規定之服裝。 1. The first four weeks, as well as the midterm and final exams, will be held in a regular classroom. The remaining weeks will take place in the cleanroom for hands-on training. 2. When attending cleanroom laboratory sessions, students must wear clothing that complies with safety regulations, including long pants.

預期每週課前與課後學習時數: 各兩小時

Introduction to Microfabrication 作者：Sami Franssila 出版社：Wiley (2nd Edition, 2010)

Silicon VLSI Technology: Fundamentals, Practice and Modeling 作者：James D. Plummer, Michael D. Deal, Peter B. Griffin 出版社：Prentice Hall (2000)