Serial Number
25334
Course Number
ME5051
Course Identifier
522 U6260
No Class
- 3 Credits
Elective
DEPARTMENT OF MECHANICAL ENGINEERING / GRADUATE INSTITUTE OF MECHANICAL ENGINEERING
DEPARTMENT OF MECHANICAL ENGINEERING
GRADUATE INSTITUTE OF MECHANICAL ENGINEERING
Elective- WEI-EN FU
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COLLEGE OF ENGINEERING DEPARTMENT OF MECHANICAL ENGINEERING
- Thu A, B, C
工綜205
Type 2
30 Student Quota
NTU 30
No Specialization Program
- Chinese
- NTU COOL
- Notes
NTU Enrollment Status
Enrolled0/30Other Depts0/0Remaining0Registered0- Course DescriptionThe feature sizes involved for advanced technology nodes in semiconductor manufacturing continue to plunge into nanoscale levels. The demands for more effective and accurate measurements both in-line and off-line in the processes with feature sizes below a few nanometers are urgent and critical. This course intends to deliver fundamental concepts and practical aspects of semiconductor metrology for those frequently used characterization tools in device fabrication to students.
- Course ObjectiveThe following contents will be covered as: -Nanoscale metrology and instrumentations -FEOL Critical dimension measurements in Semiconductor Manufacturing -Film thickness measurements: X-Ray Reflection (XRR), Spectroscopic Ellipsometry (SE) -Particle Metrology, Defects and Inspections After completing the course the student should be able to: -Describe fundamentals of measurement principles for nanometrology -Evaluate the “metrology” for Critical Dimensions in front end processes -Explain the inline inspections for nanoparticles -Assess analytical methods for film thickness
- Course Requirement
- Expected weekly study hours before and/or after class
- Office Hour
- Designated Reading
- ReferencesNo textbook assigned, but selected readings can be found from the following books Semiconductor and Nano Metrology Related: Metrology and Diagnostic Techniques for Nanoelectronics, CRC Press, 2017, Zhiyong Ma Semiconductor Nanotechnology Advances in Information and Energy Processing and Storage, Springer, 2018, Stephen M. Goodnick 3D Microelectronic Packaging From Fundamentals to Applications, Springer, 2017, Yan Li Introduction to Metrology Applications in IC Manufacturing, SPIE, 2015, Bo Su, Eric Solecky, Alok Vaid X-Ray Related: X-Ray Metrology in Semiconductor Manufacturing, Taylor & Francis, 2006, D. Keith Bowen Elements of modern X-ray physics, Jens Als-Nielsen, 2001, John Wiely and Sons X-Ray Diffraction: In Crystals, Imperfect Crystals, and Amorphous Bodies (Dover Books on Physics), 1994, A Guinier Methods of X-ray and Neutron Scattering in Polymer Science, Oxford University Press, 2000, R.-J. Roe Soft X-Rays and Extreme Ultraviolet Radiation: Principles and Applications, 2012, D. Attwood
- Grading
- Adjustment methods for students
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